HKSTP AND J2 Semiconductor Sign MoU to promote the development of microelectronics industry in Hong Kong

With support from the Innovation, Technology and Industry Bureau and the Office for Attracting Strategic Enterprises (OASES),  Chairman of Hong Kong Science and Technology Parks Corporation, Co-Chair of GBA Alliance, Dr. Sunny Chai Ngai Chiu . represent HKSTP signed a Memorandum of Understanding (MoU) with mainland China-based microelectronics enterprise J2 Semiconductor (Shanghai) Co. Ltd. , to set up a global research and development (R&D) Centre focusing on third-generation semiconductors at the Hong Kong Science Park, and to set up Hong Kong's first Silicon Carbide (SiC) 8-inch advanced wafer fab.